GD1000HTA75P6HFLT_U P6 package

GD1000HTA75P6HFLT_U

The GD1000HTA75P6HFLT_U is a 750V 1000A Automotive IGBT Module in a 3 Phase Bridge with NTC configuration, built on Micro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses chip technology. It is housed in the P6 package. Thermal design: isolated copper pinfin baseplate.

Typical applications include Hybrid and Electric Vehicle, Inverter for motor drive. It targets the Automotive market. Key electrical characteristics: VCE(sat) 1.15 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD1000HTA75P6HFLT_U
CategoryAutomotive IGBT Module
Voltage750V
Current1000A
Chip technologyMicro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses
Circuit topology3 Phase Bridge with NTC
PackageP6
BaseplateIsolated copper pinfin baseplate
SubstrateSi3N4 AMB technology
VCE(sat) @ 25°C1.15 V
Statusactive

Applications

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Download datasheet (PDF)