GD400FFX75P3H P3 package

GD400FFX75P3H

The GD400FFX75P3H is a 750V 400A Automotive IGBT Module in a 3 Phase Bridge with NTC configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the P3 package. Thermal design: baseplate‑less power module with exposed DBC substrate for direct cooling.

Typical applications include Hybrid and Electric Vehicle, Inverter for motor drive. It targets the Automotive market. Key electrical characteristics: VCE(sat) 1.4 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD400FFX75P3H
CategoryAutomotive IGBT Module
Voltage750V
Current400A
Chip technologyTrench FS IGBT, Low Loss
Circuit topology3 Phase Bridge with NTC
PackageP3
BaseplateBaseplate‑less power module with exposed DBC substrate for direct cooling
SubstrateDBC technology
VCE(sat) @ 25°C1.4 V
Statusactive

Applications

Markets

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Download datasheet (PDF)