GD550FFA75P3S P3 package

GD550FFA75P3S

The GD550FFA75P3S is a 750V 550A Automotive IGBT Module in a 3 Phase Bridge with NTC configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the P3 package. Thermal design: isolated copper baseplate.

Typical applications include Hybrid and Electric Vehicle, Inverter for motor drive. It targets the Automotive market. Key electrical characteristics: VCE(sat) 1.35 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD550FFA75P3S
CategoryAutomotive IGBT Module
Voltage750V
Current550A
Chip technologyTrench FS IGBT, Low Loss
Circuit topology3 Phase Bridge with NTC
PackageP3
BaseplateIsolated copper baseplate
SubstrateDBC technology
VCE(sat) @ 25°C1.35 V
Statusactive

Applications

Markets

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Download datasheet (PDF)