GD560HTA75P7H_T1
The GD560HTA75P7H_T1 is a 750V 560A Automotive IGBT Module in a 3 Phase Bridge with NTC configuration, built on Micro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses chip technology. It is housed in the P7 package. Thermal design: isolated copper pinfin baseplate.
Typical applications include Inverter for motor drive. It targets the Automotive market. Key electrical characteristics: VCE(sat) 1.1 V (at 25°C). Download the datasheet for full specifications and ordering information.
Technical specifications
| Part number | GD560HTA75P7H_T1 |
|---|---|
| Category | Automotive IGBT Module |
| Voltage | 750V |
| Current | 560A |
| Chip technology | Micro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses |
| Circuit topology | 3 Phase Bridge with NTC |
| Package | P7 |
| Baseplate | Isolated copper pinfin baseplate |
| Substrate | DBC technology |
| VCE(sat) @ 25°C | 1.1 V |
| Status | new |