GD560HTX75P7HB
The GD560HTX75P7HB is a 750V 560A Automotive IGBT Module in a 3 Phase Bridge with NTC configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the P7 package. Thermal design: isolated copper pinfin baseplate.
Typical applications include Hybrid and Electric Vehicle, Inverter for motor drive. It targets the Automotive market. Key electrical characteristics: VCE(sat) 1.25 V (at 25°C). Download the datasheet for full specifications and ordering information.
Technical specifications
| Part number | GD560HTX75P7HB |
|---|---|
| Category | Automotive IGBT Module |
| Voltage | 750V |
| Current | 560A |
| Chip technology | Trench FS IGBT, Low Loss |
| Circuit topology | 3 Phase Bridge with NTC |
| Package | P7 |
| Baseplate | Isolated copper pinfin baseplate |
| Substrate | DBC technology |
| VCE(sat) @ 25°C | 1.25 V |
| Status | not for new design |