GD660HTA75P7HT_T2 P7 package

GD660HTA75P7HT_T2

The GD660HTA75P7HT_T2 is a 750V 660A Automotive IGBT Module in a 3 Phase Bridge with NTC configuration, built on Micro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses chip technology. It is housed in the P7 package. Thermal design: isolated copper pinfin baseplate.

Typical applications include Hybrid and Electric Vehicle, Inverter for motor drive. It targets the Automotive market. Key electrical characteristics: VCE(sat) 1.25 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD660HTA75P7HT_T2
CategoryAutomotive IGBT Module
Voltage750V
Current660A
Chip technologyMicro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses
Circuit topology3 Phase Bridge with NTC
PackageP7
BaseplateIsolated copper pinfin baseplate
SubstrateSi3N4 AMB technology
VCE(sat) @ 25°C1.25 V
Statusnew

Applications

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Download datasheet (PDF)