GD660HTX75P7HB P7 package

GD660HTX75P7HB

The GD660HTX75P7HB is a 750V 660A Automotive IGBT Module in a 3 Phase Bridge with NTC configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the P7 package. Thermal design: isolated copper pinfin baseplate.

Typical applications include Hybrid and Electric Vehicle, Inverter for motor drive. It targets the Automotive market. Key electrical characteristics: VCE(sat) 1.25 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD660HTX75P7HB
CategoryAutomotive IGBT Module
Voltage750V
Current660A
Chip technologyTrench FS IGBT, Low Loss
Circuit topology3 Phase Bridge with NTC
PackageP7
BaseplateIsolated copper pinfin baseplate
SubstrateSi3N4 AMB technology
VCE(sat) @ 25°C1.25 V
Statusactive

Applications

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Download datasheet (PDF)