GD660HTX75P7HB_D P7 package

GD660HTX75P7HB_D

The GD660HTX75P7HB_D is a 750V 660A Automotive IGBT Module in a 3 Phase Bridge with NTC configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the P7 package. Thermal design: isolated copper pinfin baseplate.

Typical applications include Hybrid and Electric Vehicle, Inverter for motor drive. It targets the Automotive market. Key electrical characteristics: VCE(sat) 1.25 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD660HTX75P7HB_D
CategoryAutomotive IGBT Module
Voltage750V
Current660A
Chip technologyTrench FS IGBT, Low Loss
Circuit topology3 Phase Bridge with NTC
PackageP7
BaseplateIsolated copper pinfin baseplate
SubstrateSi3N4 AMB technology
VCE(sat) @ 25°C1.25 V
Statusactive

Applications

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Download datasheet (PDF)