GD820HTA75P6H P6 package

GD820HTA75P6H

The GD820HTA75P6H is a 750V 820A Automotive IGBT Module in a 3 Phase Bridge with NTC configuration, built on Micro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses chip technology. It is housed in the P6 package. Thermal design: isolated copper pinfin baseplate.

Typical applications include Hybrid and Electric Vehicle, Inverter for motor drive. It targets the Automotive market. Key electrical characteristics: VCE(sat) 1.1 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD820HTA75P6H
CategoryAutomotive IGBT Module
Voltage750V
Current820A
Chip technologyMicro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses
Circuit topology3 Phase Bridge with NTC
PackageP6
BaseplateIsolated copper pinfin baseplate
SubstrateDBC technology
VCE(sat) @ 25°C1.1 V
Statusnot for new design

Applications

Markets

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Download datasheet (PDF)