GD950HTX75P6HB P6 package

GD950HTX75P6HB

The GD950HTX75P6HB is a 750V 950A Automotive IGBT Module in a 3 Phase Bridge with NTC configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the P6 package. Thermal design: isolated copper pinfin baseplate.

Typical applications include Hybrid and Electric Vehicle, Inverter for motor drive. It targets the Automotive market. Key electrical characteristics: VCE(sat) 1.25 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD950HTX75P6HB
CategoryAutomotive IGBT Module
Voltage750V
Current950A
Chip technologyTrench FS IGBT, Low Loss
Circuit topology3 Phase Bridge with NTC
PackageP6
BaseplateIsolated copper pinfin baseplate
SubstrateSi3N4 AMB technology
VCE(sat) @ 25°C1.25 V
Statusnot for new design

Applications

Markets

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Download datasheet (PDF)