GD820HTX75P6HD P6 package

GD820HTX75P6HD

The GD820HTX75P6HD is a Automotive IGBT Module in a 3 Phase Bridge with NTC configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the P6 package. Thermal design: isolated copper pinfin baseplate.

Typical applications include Hybrid and Electric Vehicle, Inverter for motor drive. It targets the Automotive market. Key electrical characteristics: VCE(sat) 1.25 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD820HTX75P6HD
CategoryAutomotive IGBT Module
Chip technologyTrench FS IGBT, Low Loss
Circuit topology3 Phase Bridge with NTC
PackageP6
BaseplateIsolated copper pinfin baseplate
SubstrateDBC technology
VCE(sat) @ 25°C1.25 V
Statusactive

Applications

Markets

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Download datasheet (PDF)