GD200FYS100F6S F6 package

GD200FYS100F6S

The GD200FYS100F6S is a 1000V 200A IGBT Module in a Special Circuit 4 configuration, built on Advanced Trench FS IGBT, Low Loss chip technology. It is housed in the F6 package. Thermal design: isolated copper baseplate.

Typical applications include Solar Power. It targets the New Energies market. Key electrical characteristics: VCE(sat) 1.9 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD200FYS100F6S
CategoryIGBT Module
Voltage1000V
Current200A
Chip technologyAdvanced Trench FS IGBT, Low Loss
Circuit topologySpecial Circuit 4
PackageF6
BaseplateIsolated copper baseplate
SubstrateDBC technology
VCE(sat) @ 25°C1.9 V
Statusactive

Applications

Markets

Download datasheet (PDF)