GD1100HFA120C6SF C6.1 package

GD1100HFA120C6SF

The GD1100HFA120C6SF is a 1200V 1100A IGBT Module in a Half Bridge configuration, built on Micro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses chip technology. It is housed in the C6.1 package. Thermal design: isolated copper baseplate.

Typical applications include AC and DC servo drive amplifier, Inverter for motor drive, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.3 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD1100HFA120C6SF
CategoryIGBT Module
Voltage1200V
Current1100A
Chip technologyMicro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses
Circuit topologyHalf Bridge
PackageC6.1
BaseplateIsolated copper baseplate
SubstrateSi3N4 AMB technology
VCE(sat) @ 25°C1.3 V
Statusnot for new design

Applications

Markets

Related products

Download datasheet (PDF)