GD200HFA120C2S_B20 C2 package

GD200HFA120C2S_B20

The GD200HFA120C2S_B20 is a 1200V 200A IGBT Module in a Half Bridge configuration, built on Micro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses chip technology. It is housed in the C2 package. Thermal design: isolated copper baseplate.

Typical applications include AC and DC servo drive amplifier, Inverter for motor drive, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.35 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD200HFA120C2S_B20
CategoryIGBT Module
Voltage1200V
Current200A
Chip technologyMicro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses
Circuit topologyHalf Bridge
PackageC2
BaseplateIsolated copper baseplate
SubstrateDBC technology
VCE(sat) @ 25°C1.35 V
Statusactive

Applications

Markets

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Download datasheet (PDF)