GD200HFU120C2SD C2 package

GD200HFU120C2SD

The GD200HFU120C2SD is a 1200V 200A IGBT Module in a Half Bridge configuration, built on NPT Ultra Fast IGBT chip technology. It is housed in the C2 package. Thermal design: isolated copper baseplate.

Typical applications include Inductive heating. It targets the Industrial market. Key electrical characteristics: VCE(sat) 3 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD200HFU120C2SD
CategoryIGBT Module
Voltage1200V
Current200A
Chip technologyNPT Ultra Fast IGBT
Circuit topologyHalf Bridge
PackageC2
BaseplateIsolated copper baseplate
SubstrateDBC technology
VCE(sat) @ 25°C3 V
Statusactive

Applications

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Download datasheet (PDF)