GD200TLQ120L3S L3 black case package

GD200TLQ120L3S

The GD200TLQ120L3S is a 1200V 200A IGBT Module in a NPC2 configuration, built on Advanced Trench FS IGBT, Low Loss chip technology. It is housed in the L3 black case package. Thermal design: baseplate‑less power module with exposed DBC substrate for direct cooling.

Typical applications include Solar Power, UPS. It targets the Industrial and New Energies markets. Key electrical characteristics: VCE(sat) 1.45 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD200TLQ120L3S
CategoryIGBT Module
Voltage1200V
Current200A
Chip technologyAdvanced Trench FS IGBT, Low Loss
Circuit topologyNPC2
PackageL3 black case
BaseplateBaseplate‑less power module with exposed DBC substrate for direct cooling
SubstrateDBC technology
VCE(sat) @ 25°C1.45 V
Statusactive

Applications

Markets

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Download datasheet (PDF)