GD225HFY120C6S C6.1 black case package

GD225HFY120C6S

The GD225HFY120C6S is a 1200V 225A IGBT Module in a Half Bridge configuration, built on Advanced Trench FS IGBT, Low Loss chip technology. It is housed in the C6.1 black case package. Thermal design: isolated copper baseplate.

Typical applications include AC and DC servo drive amplifier, Inverter for motor drive, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.7 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD225HFY120C6S
CategoryIGBT Module
Voltage1200V
Current225A
Chip technologyAdvanced Trench FS IGBT, Low Loss
Circuit topologyHalf Bridge
PackageC6.1 black case
BaseplateIsolated copper baseplate
SubstrateDBC technology
VCE(sat) @ 25°C1.7 V
Statusactive

Applications

Markets

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Download datasheet (PDF)