GD25FSA120L2S_B20 L2 white case package

GD25FSA120L2S_B20

The GD25FSA120L2S_B20 is a 1200V 25A IGBT Module in a 3 Phase Bridge with NTC configuration, built on Micro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses chip technology. It is housed in the L2 white case package. Thermal design: baseplate‑less power module with exposed DBC substrate for direct cooling.

Typical applications include AC and DC servo drive amplifier, Inverter for motor drive, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.5 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD25FSA120L2S_B20
CategoryIGBT Module
Voltage1200V
Current25A
Chip technologyMicro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses
Circuit topology3 Phase Bridge with NTC
PackageL2 white case
BaseplateBaseplate‑less power module with exposed DBC substrate for direct cooling
SubstrateDBC technology
VCE(sat) @ 25°C1.5 V
Statusactive

Applications

Markets

Related products

Download datasheet (PDF)