GD25FSY120L2S L2 white case package

GD25FSY120L2S

The GD25FSY120L2S is a 1200V 25A IGBT Module in a 3 Phase Bridge with NTC configuration, built on Advanced Trench FS IGBT, Low Loss chip technology. It is housed in the L2 white case package. Thermal design: baseplate‑less power module with exposed DBC substrate for direct cooling.

Typical applications include AC and DC servo drive amplifier, Inverter for motor drive, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.7 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD25FSY120L2S
CategoryIGBT Module
Voltage1200V
Current25A
Chip technologyAdvanced Trench FS IGBT, Low Loss
Circuit topology3 Phase Bridge with NTC
PackageL2 white case
BaseplateBaseplate‑less power module with exposed DBC substrate for direct cooling
SubstrateDBC technology
VCE(sat) @ 25°C1.7 V
Statusnot for new design

Applications

Markets

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Download datasheet (PDF)