GD275MJS120L6S L6 package

GD275MJS120L6S

The GD275MJS120L6S is a 1200V 275A IGBT Module in a NPC1 configuration, built on Fast Trench FS IGBT, Low Loss chip technology. It is housed in the L6 package. Thermal design: isolated copper baseplate.

Typical applications include Solar Power. It targets the New Energies market. Key electrical characteristics: VCE(sat) 2 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD275MJS120L6S
CategoryIGBT Module
Voltage1200V
Current275A
Chip technologyFast Trench FS IGBT, Low Loss
Circuit topologyNPC1
PackageL6
BaseplateIsolated copper baseplate
SubstrateSi3N4 AMB technology
VCE(sat) @ 25°C2 V
Statusactive

Applications

Markets

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Download datasheet (PDF)