GD300HFA120C6S C6.1 package

GD300HFA120C6S

The GD300HFA120C6S is a 1200V 300A IGBT Module in a Half Bridge configuration, built on Micro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses chip technology. It is housed in the C6.1 package. Thermal design: isolated copper baseplate.

Typical applications include AC and DC servo drive amplifier, Inverter for motor drive, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.5 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD300HFA120C6S
CategoryIGBT Module
Voltage1200V
Current300A
Chip technologyMicro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses
Circuit topologyHalf Bridge
PackageC6.1
BaseplateIsolated copper baseplate
SubstrateDBC technology
VCE(sat) @ 25°C1.5 V
Statusactive

Applications

Markets

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Download datasheet (PDF)