GD300MNY120C6S C6.1 package

GD300MNY120C6S

The GD300MNY120C6S is a 1200V 300A IGBT Module in a Half NPC1 Low configuration, built on Advanced Trench FS IGBT, Low Loss chip technology. It is housed in the C6.1 package. Thermal design: isolated copper baseplate.

Typical applications include Solar Power, UPS. It targets the Industrial and New Energies markets. Key electrical characteristics: VCE(sat) 1.7 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD300MNY120C6S
CategoryIGBT Module
Voltage1200V
Current300A
Chip technologyAdvanced Trench FS IGBT, Low Loss
Circuit topologyHalf NPC1 Low
PackageC6.1
BaseplateIsolated copper baseplate
SubstrateDBC technology
VCE(sat) @ 25°C1.7 V
Statusnot for new design

Applications

Markets

Download datasheet (PDF)