GD600HFX120C2SA_B20 C2 package

GD600HFX120C2SA_B20

The GD600HFX120C2SA_B20 is a 1200V 600A IGBT Module in a Half Bridge configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the C2 package. Thermal design: isolated copper baseplate.

Typical applications include AC and DC servo drive amplifier, Inverter for motor drive, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.7 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD600HFX120C2SA_B20
CategoryIGBT Module
Voltage1200V
Current600A
Chip technologyTrench FS IGBT, Low Loss
Circuit topologyHalf Bridge
PackageC2
BaseplateIsolated copper baseplate
SubstrateHPS DBC technology
VCE(sat) @ 25°C1.7 V
Statusactive

Applications

Markets

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Download datasheet (PDF)