GD600HFY120C6SF C6.1 package

GD600HFY120C6SF

The GD600HFY120C6SF is a 1200V 600A IGBT Module in a H Bridge configuration, built on Advanced Trench FS IGBT, Low Loss chip technology. It is housed in the C6.1 package. Thermal design: isolated copper baseplate.

Typical applications include AC and DC servo drive amplifier, Inverter for motor drive, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.7 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD600HFY120C6SF
CategoryIGBT Module
Voltage1200V
Current600A
Chip technologyAdvanced Trench FS IGBT, Low Loss
Circuit topologyH Bridge
PackageC6.1
BaseplateIsolated copper baseplate
SubstrateDBC technology
VCE(sat) @ 25°C1.7 V
Statusactive

Applications

Markets

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Download datasheet (PDF)