GD75FSA120L3S L3 black case package

GD75FSA120L3S

The GD75FSA120L3S is a 1200V 75A IGBT Module in a 3 Phase Bridge with NTC configuration, built on Micro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses chip technology. It is housed in the L3 black case package. Thermal design: baseplate‑less power module with exposed DBC substrate for direct cooling.

Typical applications include AC and DC servo drive amplifier, Inverter for motor drive, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.5 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD75FSA120L3S
CategoryIGBT Module
Voltage1200V
Current75A
Chip technologyMicro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses
Circuit topology3 Phase Bridge with NTC
PackageL3 black case
BaseplateBaseplate‑less power module with exposed DBC substrate for direct cooling
SubstrateDBC technology
VCE(sat) @ 25°C1.5 V
Statusactive

Applications

Markets

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Download datasheet (PDF)