GD800HFA120C6SD C6.1 package

GD800HFA120C6SD

The GD800HFA120C6SD is a 1200V 800A IGBT Module in a Half Bridge configuration, built on Micro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses chip technology. It is housed in the C6.1 package. Thermal design: isolated copper baseplate.

Typical applications include AC and DC servo drive amplifier, Inverter for motor drive, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.4 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD800HFA120C6SD
CategoryIGBT Module
Voltage1200V
Current800A
Chip technologyMicro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses
Circuit topologyHalf Bridge
PackageC6.1
BaseplateIsolated copper baseplate
SubstrateDBC technology
VCE(sat) @ 25°C1.4 V
Statusactive

Applications

Markets

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Download datasheet (PDF)