GD1200HFX170A3S A3 package

GD1200HFX170A3S

The GD1200HFX170A3S is a 1700V 1200A IGBT Module in a Half Bridge configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the A3 package. Thermal design: alSiC baseplate.

Typical applications include Inverter for motor drive, Wind Power. It targets the Industrial and New Energies markets. Key electrical characteristics: VCE(sat) 1.85 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD1200HFX170A3S
CategoryIGBT Module
Voltage1700V
Current1200A
Chip technologyTrench FS IGBT, Low Loss
Circuit topologyHalf Bridge
PackageA3
BaseplateAlSiC baseplate
SubstrateDBC technology
VCE(sat) @ 25°C1.85 V
Statusactive

Applications

Markets

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Download datasheet (PDF)