GD1800HFA170V6S V6 package

GD1800HFA170V6S

The GD1800HFA170V6S is a 1700V 1800A IGBT Module in a Half Bridge configuration, built on Micro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses chip technology. It is housed in the V6 package. Thermal design: isolated copper baseplate.

Typical applications include High Power Converter, Inverter for motor drive. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.55 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD1800HFA170V6S
CategoryIGBT Module
Voltage1700V
Current1800A
Chip technologyMicro Pattern Trench FS IGBT Gen2.0, Ultra Low Losses
Circuit topologyHalf Bridge
PackageV6
BaseplateIsolated copper baseplate
SubstrateDBC technology
VCE(sat) @ 25°C1.55 V
Statusactive

Applications

Markets

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Download datasheet (PDF)