GD300HFX170C2SA
The GD300HFX170C2SA is a 1700V 300A IGBT Module in a Half Bridge configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the C2 package. Thermal design: isolated copper baseplate.
Typical applications include AC and DC servo drive amplifier, Inverter for motor drive, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.85 V (at 25°C). Download the datasheet for full specifications and ordering information.
Technical specifications
| Part number | GD300HFX170C2SA |
|---|---|
| Category | IGBT Module |
| Voltage | 1700V |
| Current | 300A |
| Chip technology | Trench FS IGBT, Low Loss |
| Circuit topology | Half Bridge |
| Package | C2 |
| Baseplate | Isolated copper baseplate |
| Substrate | DBC technology |
| VCE(sat) @ 25°C | 1.85 V |
| Status | active |