GD400HFX170C2S C2 package

GD400HFX170C2S

The GD400HFX170C2S is a 1700V 400A IGBT Module in a Half Bridge configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the C2 package. Thermal design: isolated copper baseplate.

Typical applications include AC and DC servo drive amplifier, Inverter for motor drive, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.85 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD400HFX170C2S
CategoryIGBT Module
Voltage1700V
Current400A
Chip technologyTrench FS IGBT, Low Loss
Circuit topologyHalf Bridge
PackageC2
BaseplateIsolated copper baseplate
SubstrateDBC technology
VCE(sat) @ 25°C1.85 V
Statusactive

Applications

Markets

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Download datasheet (PDF)