
The GD75FFX170C6S is a 1700V 75A IGBT Module in a 3 Phase Bridge with NTC configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the C6 package. Thermal design: isolated copper baseplate.
Typical applications include Inductive heating, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.85 V (at 25°C). Download the datasheet for full specifications and ordering information.
| Part number | GD75FFX170C6S |
|---|---|
| Category | IGBT Module |
| Voltage | 1700V |
| Current | 75A |
| Chip technology | Trench FS IGBT, Low Loss |
| Circuit topology | 3 Phase Bridge with NTC |
| Package | C6 |
| Baseplate | Isolated copper baseplate |
| Substrate | DBC technology |
| VCE(sat) @ 25°C | 1.85 V |
| Status | not for new design |