GD150HFX65C1S C1 package

GD150HFX65C1S

The GD150HFX65C1S is a 650V 150A IGBT Module in a Half Bridge configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the C1 package. Thermal design: isolated copper baseplate.

Typical applications include AC and DC servo drive amplifier, Inverter for motor drive, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.45 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD150HFX65C1S
CategoryIGBT Module
Voltage650V
Current150A
Chip technologyTrench FS IGBT, Low Loss
Circuit topologyHalf Bridge
PackageC1
BaseplateIsolated copper baseplate
SubstrateDBC technology
VCE(sat) @ 25°C1.45 V
Statusactive

Applications

Markets

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Download datasheet (PDF)