GD150MLX65L3S L3 black case package

GD150MLX65L3S

The GD150MLX65L3S is a 650V 150A IGBT Module in a NPC1 configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the L3 black case package. Thermal design: baseplate‑less power module with exposed DBC substrate for direct cooling.

Typical applications include Solar Power, UPS. It targets the Industrial and New Energies markets. Key electrical characteristics: VCE(sat) 1.45 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD150MLX65L3S
CategoryIGBT Module
Voltage650V
Current150A
Chip technologyTrench FS IGBT, Low Loss
Circuit topologyNPC1
PackageL3 black case
BaseplateBaseplate‑less power module with exposed DBC substrate for direct cooling
SubstrateDBC technology
VCE(sat) @ 25°C1.45 V
Statusactive

Applications

Markets

Related products

Download datasheet (PDF)