GD200FFX65C6S C6 package

GD200FFX65C6S

The GD200FFX65C6S is a 650V 200A IGBT Module in a 3 Phase Bridge with NTC configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the C6 package. Thermal design: isolated copper baseplate.

Typical applications include AC and DC servo drive amplifier, Inverter for motor drive, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.45 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD200FFX65C6S
CategoryIGBT Module
Voltage650V
Current200A
Chip technologyTrench FS IGBT, Low Loss
Circuit topology3 Phase Bridge with NTC
PackageC6
BaseplateIsolated copper baseplate
SubstrateDBC technology
VCE(sat) @ 25°C1.45 V
Statusactive

Applications

Markets

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Download datasheet (PDF)