GD200MLX65C2S C2.6 package

GD200MLX65C2S

The GD200MLX65C2S is a 650V 200A IGBT Module in a NPC1 configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the C2.6 package. Thermal design: isolated copper baseplate.

Typical applications include Solar Power, UPS. It targets the Industrial and New Energies markets. Key electrical characteristics: VCE(sat) 1 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD200MLX65C2S
CategoryIGBT Module
Voltage650V
Current200A
Chip technologyTrench FS IGBT, Low Loss
Circuit topologyNPC1
PackageC2.6
BaseplateIsolated copper baseplate
SubstrateDBC technology
VCE(sat) @ 25°C1 V
Statusactive

Applications

Markets

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Download datasheet (PDF)