GD20FSX65L2S L2 black case package

GD20FSX65L2S

The GD20FSX65L2S is a 650V 20A IGBT Module in a 3 Phase Bridge with NTC configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the L2 black case package. Thermal design: baseplate‑less power module with exposed DBC substrate for direct cooling.

Typical applications include AC and DC servo drive amplifier, Inverter for motor drive, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.45 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD20FSX65L2S
CategoryIGBT Module
Voltage650V
Current20A
Chip technologyTrench FS IGBT, Low Loss
Circuit topology3 Phase Bridge with NTC
PackageL2 black case
BaseplateBaseplate‑less power module with exposed DBC substrate for direct cooling
SubstrateDBC technology
VCE(sat) @ 25°C1.45 V
Statusactive

Applications

Markets

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Download datasheet (PDF)