GD300HFX65C6S C6.1 package

GD300HFX65C6S

The GD300HFX65C6S is a 650V 300A IGBT Module in a Half Bridge configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the C6.1 package. Thermal design: isolated copper baseplate.

Typical applications include AC and DC servo drive amplifier, Inverter for motor drive, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.45 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD300HFX65C6S
CategoryIGBT Module
Voltage650V
Current300A
Chip technologyTrench FS IGBT, Low Loss
Circuit topologyHalf Bridge
PackageC6.1
BaseplateIsolated copper baseplate
SubstrateDBC technology
VCE(sat) @ 25°C1.45 V
Statusactive

Applications

Markets

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Download datasheet (PDF)