GD300MLX65B3ST
The GD300MLX65B3ST is a 650V 300A IGBT Module in a NPC1 configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the B3 package. Thermal design: isolated copper baseplate.
Typical applications include Solar Power, UPS. It targets the Industrial and New Energies markets. Key electrical characteristics: VCE(sat) 1.45 V (at 25°C). Download the datasheet for full specifications and ordering information.
Technical specifications
| Part number | GD300MLX65B3ST |
|---|---|
| Category | IGBT Module |
| Voltage | 650V |
| Current | 300A |
| Chip technology | Trench FS IGBT, Low Loss |
| Circuit topology | NPC1 |
| Package | B3 |
| Baseplate | Isolated copper baseplate |
| Substrate | DBC technology |
| VCE(sat) @ 25°C | 1.45 V |
| Status | active |