GD30PJX65F1S F1 package

GD30PJX65F1S

The GD30PJX65F1S is a 650V 30A IGBT Module in a PIM : 3 Phase Rectifier + Brake + 3 Phase Inverter OE configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the F1 package. Thermal design: baseplate‑less power module with exposed DBC substrate for direct cooling.

Typical applications include AC and DC servo drive amplifier, Inverter for motor drive, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.45 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD30PJX65F1S
CategoryIGBT Module
Voltage650V
Current30A
Chip technologyTrench FS IGBT, Low Loss
Circuit topologyPIM : 3 Phase Rectifier + Brake + 3 Phase Inverter OE
PackageF1
BaseplateBaseplate‑less power module with exposed DBC substrate for direct cooling
SubstrateDBC technology
VCE(sat) @ 25°C1.45 V
Statusactive

Applications

Markets

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Download datasheet (PDF)