GD30PUX65F1S_B22 F1 package

GD30PUX65F1S_B22

The GD30PUX65F1S_B22 is a 650V 30A IGBT Module in a PIM : Single Phase Rectifier + 3 Phase Inverter configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the F1 package. Thermal design: baseplate‑less power module with exposed DBC substrate for direct cooling.

Typical applications include AC and DC servo drive amplifier, Inverter for motor drive, UPS. It targets the Industrial market. Key electrical characteristics: VCE(sat) 1.45 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD30PUX65F1S_B22
CategoryIGBT Module
Voltage650V
Current30A
Chip technologyTrench FS IGBT, Low Loss
Circuit topologyPIM : Single Phase Rectifier + 3 Phase Inverter
PackageF1
BaseplateBaseplate‑less power module with exposed DBC substrate for direct cooling
SubstrateDBC technology
VCE(sat) @ 25°C1.45 V
Statusactive

Applications

Markets

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Download datasheet (PDF)