GD400TUX65C2S C2.6 package

GD400TUX65C2S

The GD400TUX65C2S is a 650V 400A IGBT Module in a NPC1 Boost configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the C2.6 package. Thermal design: isolated copper baseplate.

Typical applications include Solar Power, UPS. It targets the Industrial and New Energies markets. Key electrical characteristics: VCE(sat) 1.45 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD400TUX65C2S
CategoryIGBT Module
Voltage650V
Current400A
Chip technologyTrench FS IGBT, Low Loss
Circuit topologyNPC1 Boost
PackageC2.6
BaseplateIsolated copper baseplate
SubstrateDBC technology
VCE(sat) @ 25°C1.45 V
Statusactive

Applications

Markets

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Download datasheet (PDF)