GD50MLX65F1S F1 package

GD50MLX65F1S

The GD50MLX65F1S is a 650V 50A IGBT Module in a NPC1 configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the F1 package. Thermal design: baseplate‑less power module with exposed DBC substrate for direct cooling.

Typical applications include Solar Power, UPS. It targets the Industrial and New Energies markets. Key electrical characteristics: VCE(sat) 1.45 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD50MLX65F1S
CategoryIGBT Module
Voltage650V
Current50A
Chip technologyTrench FS IGBT, Low Loss
Circuit topologyNPC1
PackageF1
BaseplateBaseplate‑less power module with exposed DBC substrate for direct cooling
SubstrateDBC technology
VCE(sat) @ 25°C1.45 V
Statusactive

Applications

Markets

Related products

Download datasheet (PDF)