GD75MLX65L3S_B20 L3 white case package

GD75MLX65L3S_B20

The GD75MLX65L3S_B20 is a 650V 75A IGBT Module in a NPC1 configuration, built on Trench FS IGBT, Low Loss chip technology. It is housed in the L3 white case package. Thermal design: baseplate‑less power module with exposed DBC substrate for direct cooling.

Typical applications include Solar Power, UPS. It targets the Industrial and New Energies markets. Key electrical characteristics: VCE(sat) 1.45 V (at 25°C). Download the datasheet for full specifications and ordering information.

Technical specifications

Part numberGD75MLX65L3S_B20
CategoryIGBT Module
Voltage650V
Current75A
Chip technologyTrench FS IGBT, Low Loss
Circuit topologyNPC1
PackageL3 white case
BaseplateBaseplate‑less power module with exposed DBC substrate for direct cooling
SubstrateDBC technology
VCE(sat) @ 25°C1.45 V
Statusactive

Applications

Markets

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Download datasheet (PDF)